Y10S 228/903
Metal to nonmetal
Y10S228/903 (Metal to nonmetal) appears on 82 US grants and 5 published applications in this corpus.
Search patents in Y10S- Granted patents
- 82
- Published applications
- 5
- Assignees
- 58
- Inventors
- 180
- Latest grant
- 2 Dec 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 9 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 1 |
| 2002 | 9 | 0 |
| 2003 | 2 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for bonding refractory ceramic and metal2 Dec 2014US 8,899,470 B2Corning Incorporated
- Weldable ultrahard materials and associated methods of manufacture14 Oct 2008US 7,435,377 B2ADICO, Asia Polydiamond Company, Ltd.
- Method of manufacturing commutator of rotary electric machine16 May 2006US 7,043,822 B2Denso Corporation
- Brittle article comprising joined-together hardened glass and/or glass-ceramic parts and method of making same2 Mar 2004US 6,698,242 B1Schott Glas
- Method of making a carbon commutator assembly21 Oct 2003US 6,634,082 B1
- Bonded refractory ceramic and metal article13 Nov 2014US 2014/0331718 A1Corning Incorporated
- Method for bonding refractory ceramic and metal4 Jun 2009US 2009/0142608 A1Corning Incorporated
- Weldable ultrahard materials and associated methods of manufacture15 Feb 2007US 2007/0034416 A1ADICO, Asia Polydiamond Company, Ltd.
- Method of manufacturing commutator of rotary electric machine25 Nov 2004US 2004/0232798 A1Denso Corporation
- Method for sealing and/or joining an end of a ceramic filter29 Nov 2001US 2001/0044999 A1CoorsTek, Inc.
Most cited
By later US patents
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Alloy for metallization and brazing of abrasive materials94US 4,009,027 A1977
- Method for bubble-free bonding of silicon wafers73US 4,962,879 ADuke University · 1990
- Polishing pad conditioning device with cutting elements72US 6,371,838 B1SpeedFam-IPEC Corporation · 2002
- Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor71US 4,769,345 AOlin Corporation · 1988