Method for bubble-free bonding of silicon wafers

A method for bonding at least two wafers and storing the bonded wafers in a wafer container wherein said at least two wafers includes at least one first wafer comprising silicon and at least one second wafer comprising either silicon or glass wherein each of said wafers has at least one mirror-polished surface, including the steps of:

• positioning said first and second wafers in closely spaced-apart and parallel relationship to each other with inert spacer elements adjacent the perimeter of said wafers and with each of said wafers having a mirror-polished surface opposing a mirror-polished surface of the other wafer;
• introducing a hydrophilization cleansing solution onto the opposing mirror-polished surfaces of said first and second wafers;
• flushing said cleansing solution from said mirror-polished surfaces of said first and second wafers with deionized water;
• spin-drying said mirror-polished surfaces of said first and second wafers;
• removing said spacer elements from contact with the perimeter of said first and second wafers and moving said first and second wafers together so that contact occurs between said opposing mirror-polished surfaces of said first and second wafers;
• and
• placing a plurality of said bonded first and second wafers into a wafer shipping and storage container.

A method for bonding at least two wafers and storing the bonded wafers in a wafer container wherein said at least two wafers includes at least one first semiconductor wafer and at least one second wafer comprising either a semiconductor material or glass wherein each of said wafers has at least one mirror-polished surface, including the steps of:

• positioning said first and second wafers in closely spaced-apart and parallel relationship to each other and with each of said wafers having a mirror-polished surface opposing a mirror-polished surface of the other wafer;
• cleansing said mirror-polished surfaces of said first and second wafers;
• drying said mirror-polished surfaces of said first and second wafers;
• moving said first and second wafers together so that contact occurs between said opposing mirror-polished surfaces of said first and second wafers;
• and
• placing a plurality of said bonded first and second wafers into a wafer shipping and storage container.