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US 2012/0031955 A1Published application
Wire bonding method and capillary enabling high-speed wedge bonding of wire bonds
AssigneeNational Semiconductor Corporation
InventorKen Pham
Life of this patent
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Abstract
Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
Claims22
1-15. (canceled)
A wire bonding apparatus comprising:
- a support for holding wire bonding substrates;
- a wire bonding capillary with an aperture for carrying and extruding bond wire and enabling bond wire attachment to wire bonding substrates;
- a movable deflector element arranged to move generally adjacent to a facing surface of the capillary to bend an extruded length of bonding wire such that the bent extruded length of bonding wire can be articulated at different bond line angles while maintaining a constant rotational orientation for the capillary;
- wherein the movable deflector member having an aperture comprising a center with an inner surface of the aperture arranged concentrically about the center further including a plurality of wire guide features to assist positioning of the extruded length of bonding wire wherein a first wire guide feature comprises a recessed portion that lies a greater radial distance from the center of the aperture than a remaining portion of the inner surface of the aperture;
- and wherein the capillary comprises a facing surface that includes at least one of roughened texture arranged on the facing surface, a pattern of intersecting ridges forming a criss-crossed pattern arranged on the facing surface, and a series of ridges arranged on the facing surface;
- and
- a controller configured to enable control the operation of the wire bonding apparatus.
4 more elements
30-38. (canceled)
A wire bonding apparatus comprising:
- a support for holding wire bonding substrates;
- a wire bonding capillary with an aperture for carrying and extruding bond wire and enabling bond wire attachment to wire bonding substrates;
- a movable deflector element arranged to move generally adjacent to a facing surface of the capillary to bend an extruded length of bonding wire such that the bent extruded length of bonding wire can be articulated at different bond line angles while maintaining a constant rotational orientation for the capillary;
- and wherein at least one wire guide feature assists in aligning the extruded length of bonding wire in a desired orientation enabling said articulation at specified bond line angle, wherein said at least one wire guide feature is arranged on at least one of a facing surface of the capillary and the inner surface of the movable deflector
- and wherein the capillary comprises a facing surface, the facing surface comprises a surface pattern of oxide removal features wherein said features comprise at least one of;
- a pattern of intersecting ridges forming a criss-crossed pattern arranged on the facing surface;
- and
- a series of ridges arranged on the facing surface, each configured to remove an oxide surface from said extruded bond wire during a wedge bonding process;
- and
- a controller configured to enable control the operation of the wire bonding apparatus.
7 more elements
Dependencies are inferred from the claim text.