Y10S 156/941
Means for delaminating semiconductive product
Y10S156/941 (Means for delaminating semiconductive product) appears on 252 US grants and 174 published applications in this corpus.
Search patents in Y10S- Granted patents
- 252
- Published applications
- 174
- Assignees
- 127
- Inventors
- 465
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 19 | 0 |
| 2001 | 16 | 5 |
| 2002 | 11 | 17 |
| 2003 | 11 | 14 |
| 2004 | 17 | 7 |
| 2005 | 12 | 11 |
| 2006 | 4 | 3 |
| 2007 | 5 | 3 |
| 2008 | 3 | 4 |
| 2009 | 1 | 2 |
| 2010 | 3 | 4 |
| 2011 | 4 | 10 |
| 2012 | 9 | 8 |
| 2013 | 2 | 16 |
| 2014 | 10 | 9 |
| 2015 | 18 | 11 |
| 2016 | 9 | 10 |
| 2017 | 10 | 10 |
| 2018 | 14 | 7 |
| 2019 | 14 | 12 |
| 2020 | 7 | 6 |
| 2021 | 5 | 2 |
| 2022 | 5 | 2 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method for manufacturing display device and display device manufacturing apparatus15 Apr 2025US 12,278,223 B2Semiconductor Energy Laboratory Co.Ltd.
- Detaching a die from an adhesive tape by air ejection19 Sep 2023US 11,764,098 B2Asmpt Singapore Pte. Ltd.
- Apparatus for separating a window and method for separating a window using the same4 Oct 2022US 11,458,721 B2Samsung Display Co., Ltd.
- Method and apparatus for transferring micro device, and electronic product using the same16 Aug 2022US 11,417,546 B2Korea Institute of Machinery & Materials
- Methods for processing a substrate1 Mar 2022US 11,260,646 B2Corning Incorporated
- Method For Manufacturing Display Device and Display Device Manufacturing Apparatus15 May 2025US 2025/0158000 A1Semiconductor Energy Laboratory Co.Ltd.
- Detaching a die from an adhesive tape by air ejection20 Oct 2022US 2022/0336254 A1Asm Technology Singapore Pte Ltd
- Method for Manufacturing Display Device and Display Device Manufacturing Apparatus10 Feb 2022US 2022/0045039 A1Semiconductor Energy Laboratory Co.Ltd.
- Method and apparatus for transferring micro device, and electronic product using the same3 Jun 2021US 2021/0166959 A1Korea Institute of Machinery & Materials
- Apparatus for separating a window and method for separating a window using the same11 Mar 2021US 2021/0070030 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Method for fabricating via holes in a semiconductor wafer128US 4,348,253 ARCA Corporation · 1982
- Methods for making spring interconnect structures126US 6,491,968 B1FormFactor, Inc. · 2002
- Process for disengaging semiconductor die from an adhesive film89US 6,889,427 B2Freescale Semiconductor, Inc. · 2005
- Methods and apparatus for producing unsupported monocrystalline films of silicon and of other materials84US 4,116,751 A1978