Detaching a die from an adhesive tape by air ejection
AssigneeAsm Technology Singapore Pte Ltd
InventorsNgai Tat MAN, Yiu Ming CHEUNG, Jun QI, Chi Yung LEE
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Abstract
When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.
Claims20
A method of picking a die from an adhesive tape, the method comprising:
- positioning a collet of a pick arm at a distance over the die, the die being mounted on a first surface of the adhesive tape;
- generating a flow of air onto a second surface of the adhesive tape opposite to the first surface, for blowing the adhesive tape to displace the die towards a die-holding surface of the collet;
- and
- retaining the die on the die-holding surface of the collet while the adhesive tape separates from the die.
An apparatus for picking a die from an adhesive tape, comprising:
- a collet of a pick arm having a die-holding surface configured to be positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape;
- and
- an air-flow generator configured to generate a flow of air onto a second surface of the adhesive tape opposite to the first surface to blow the adhesive tape to displace the die towards the die-holding surface of the collet to retain the die on the die-holding surface of the collet while the adhesive tape separates from the die.
Dependencies are inferred from the claim text.