Y10S 156/943
With poking delaminating means
Official title: with poking delaminating means, e.g. jabbing means
Y10S156/943 (With poking delaminating means) appears on 51 US grants and 46 published applications in this corpus.
Search patents in Y10S- Granted patents
- 51
- Published applications
- 46
- Assignees
- 42
- Inventors
- 102
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 5 |
| 2003 | 2 | 2 |
| 2004 | 2 | 2 |
| 2005 | 3 | 2 |
| 2006 | 0 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 0 | 4 |
| 2012 | 6 | 2 |
| 2013 | 2 | 7 |
| 2014 | 5 | 4 |
| 2015 | 3 | 2 |
| 2016 | 7 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 2 |
| 2020 | 1 | 2 |
| 2021 | 1 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for manufacturing display device and display device manufacturing apparatus15 Apr 2025US 12,278,223 B2Semiconductor Energy Laboratory Co.Ltd.
- Detaching a die from an adhesive tape by air ejection19 Sep 2023US 11,764,098 B2Asmpt Singapore Pte. Ltd.
- Apparatus for separating a window and method for separating a window using the same4 Oct 2022US 11,458,721 B2Samsung Display Co., Ltd.
- Chip ejecting apparatus1 Feb 2022US 11,239,104 B2Samsung Electronics Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device13 Jul 2021US 11,062,925 B2Mitsubishi Electric Corporation
- Method For Manufacturing Display Device and Display Device Manufacturing Apparatus15 May 2025US 2025/0158000 A1Semiconductor Energy Laboratory Co.Ltd.
- Detaching a die from an adhesive tape by air ejection20 Oct 2022US 2022/0336254 A1Asm Technology Singapore Pte Ltd
- Method for Manufacturing Display Device and Display Device Manufacturing Apparatus10 Feb 2022US 2022/0045039 A1Semiconductor Energy Laboratory Co.Ltd.
- Apparatus for separating a window and method for separating a window using the same11 Mar 2021US 2021/0070030 A1Samsung Display Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device19 Nov 2020US 2020/0365430 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Process for disengaging semiconductor die from an adhesive film89US 6,889,427 B2Freescale Semiconductor, Inc. · 2005
- Method and device of peeling semiconductor device using annular contact members63US 6,824,643 B2Fujitsu Limited · 2004
- Method for separating a semiconductor element in a semiconductor element pushing-up device55US 6,555,418 B2Kabushiki Kaisha Toshiba · 2003
- Method and apparatus for removal of semiconductor chips from hybrid circuits41US 3,969,813 ABell Telephone Laboratories, Incorporated · 1976