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US 11,062,925 B2Granted
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsMasato Negishi, Kazuo Yoshida
Life of this patent
Estimating the term…
Abstract
By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.
Claims9
A semiconductor manufacturing apparatus comprising:
- a holding member holding an adhesive tape on which a semiconductor chip is pasted;
- a pickup stage on which the holding member is placed;
- a stage drive section controlling a movement of the pickup stage;
- a top photographing camera positioned above the pickup stage and photographing a position of the semiconductor chip;
- a positioning detection section detecting positional information of the semiconductor chip based on video information provided from the top photographing camera;
- a collet picking up the semiconductor chip;
- a collet drive section controlling the collet;
- a needle located below the pickup stage, having a width equivalent to that of the semiconductor chip, having a flat part on a top surface and concave portions at four corners of the top surface, and pushing up a holding member for pickup of the semiconductor chip;
- a needle stage holding the needle;
- a push-up drive section driving the needle stage;
- and
- a control section instructing the stage drive section to move the stage based on the positional information from the positioning detection section, instructing the push-up drive section to push up the semiconductor chip, and instructing the collet drive section to suction the semiconductor chip pushed up by the needle from above.
9 more elements
A method of manufacturing a semiconductor device comprising:
- placing a holding member holding an adhesive tape on which a diced semiconductor chip is pasted on a pickup stage;
- pushing up the semiconductor chip through the adhesive tape with a needle having a flat part on a top surface and concave portions at four corners of the top surface;
- and
- suctioning the semiconductor chip from above and picking up the semiconductor chip with a collet.
1 more element
Dependencies are inferred from the claim text.