Method for separating a semiconductor element in a semiconductor element pushing-up device

A method for separating a semiconductor element from an adhesive sheet in a semiconductor element pushing-up device of a die bonding apparatus comprising:

• preparing a push-up pin having a tip end portion with a constant radius of curvature over an angle of circumference equal to or larger than 180 degrees, thereby enabling uniform pushing-up pressure on the adhesive sheet such that expansion of the adhesive sheet is kept uniform when the pushing-up pressure for pushing upwardly the semiconductor element from the rear surface side of the adhesive sheet is applied;
• fixedly holding the adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum device;
• measuring a load applied to a push-up pin when the semiconductor element is pushed up from the rear surface side of the adhesive sheet by the push-up pin with the thickness of the adhesive sheet such that expansion of the adhesive sheet is kept uniform;
• and
• controlling the operating condition of the push-up pin based on the result of measurement of the load.

A method for separating a semiconductor element from an adhesive sheet in a semiconductor element pushing-up device of a die bonding apparatus comprising:

• preparing a push-up pin having a tip end portion with a constant radius of curvature over an angle of circumference equal to or larger than 180 degrees, thereby enabling uniform pushing-up pressure on the adhesive sheet such that expansion of the adhesive sheet is kept uniform when the pushing-up pressure for pushing upwardly the semiconductor element from the rear surface side of the adhesive sheet is applied;
• fixedly holding the adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum device;
• applying a voltage between an element suction head and the push-up pin and measuring a current flowing between the element suction head and the push-up pin when the semiconductor element attached to the adhesive sheet is pushed up from the rear surface side of the adhesive sheet by the push-up pin with the thickness of the adhesive sheet such that expansion of the adhesive sheet is kept uniform, separated from the adhesive sheet and then taken up by suction of the semiconductor element suction head;
• and
• controlling the operating condition of the push-up pin based on the result of measurement.

A method for separating a semiconductor element from an adhesive sheet in a semiconductor element pushing-up device by pushing upwardly the semiconductor element from a rear surface side of the adhesive sheet, comprising:

• preparing a push-up pin having a tip end portion with a constant radius of curvature over an angle of circumference equal to or larger than 180 degrees, thereby enabling uniform pushing-up pressure on the adhesive sheet such that expansion of the adhesive sheet is kept uniform when the pushing-up pressure for pushing upwardly the semiconductor element from the rear surface side of the adhesive sheet is applied;
• fixedly holding the adhesive sheet to which the semiconductor element is attached;
• and
• pushing up the push-up pins upwardly from the rear side of the adhesive sheet to separate the semiconductor element from the upper side of the adhesive sheet.

A method for separating a semiconductor element from an adhesive sheet in a semiconductor element pushing-up device by pushing upwardly the semiconductor element from a rear surface side of the adhesive sheet, comprising:

• preparing a plurality of push-up pins each having a tip end portion with a constant radius of curvature over an angle of circumference equal to or larger than 180 degrees, thereby enabling uniform pushing-up pressure on the adhesive sheet such that expansion of the adhesive sheet is kept uniform when the pushing-up pressure for pushing upwardly the semiconductor element from the rear surface side of the adhesive sheet is applied;
• fixedly holding the adhesive sheet to which the semiconductor element is attached;
• and
• pushing-up the push-up pins upwardly from the rear side of the adhesive sheet to separate the semiconductor element from the upper side of the adhesive sheet.