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US 11,764,098 B2Granted
Detaching a die from an adhesive tape by air ejection
AssigneeAsmpt Singapore Pte. Ltd.
InventorsNgai Tat Man, Yiu Ming Cheung, Jun Qi, Chi Yung Lee
Life of this patent
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Abstract
When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.
Claims16
A method of picking a die from an adhesive tape, the method comprising:
- positioning a collet of a pick arm at a distance over the die, the die being mounted on a first surface of the adhesive tape;
- generating a flow of air onto a second surface of the adhesive tape opposite to the first surface, for blowing the adhesive tape to displace the die towards a die-holding surface of the collet, wherein the second surface of the adhesive tape is retained in a retained position by an ejector cap comprising a tape-holding suction surface, and the blowing comprises generating the flow of air from the ejector cap to propel the adhesive tape away from the retained position towards the die-holding surface of the collet, and wherein the die is releasably supported by ejector plates incorporated in the ejector cap, the ejector plates being movable relative to the tape-holding suction surface for raising the die away from the tape-holding suction surface;
- and
- retaining the die on the die-holding surface of the collet while the adhesive tape separates from the die.
1 more element
Dependencies are inferred from the claim text.