Methods for processing a substrate

A method of processing a substrate, the method

• comprising:
• initiating debonding via a tool at a first location of an outer peripheral bonded interface between the substrate and a first carrier to separate a portion of the first carrier from the substrate, thereby creating a first debond front having a first debond location;
• and
• engaging a plurality of suction cups to the first carrier prior to propagating the first debond front, wherein the plurality of suction cups are configured to provide a plurality of lifting forces are sequentially applied by a respective suction cup of the plurality of suction cups after the first debond front propagates past the respective suction cup and before the first debond front propagates past an immediately adjacent suction cup of the plurality of suction cups arranged downstream from the respective suction cup along the first direction;
• and
• propagating the first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces by a corresponding plurality of suction cups arranged along the first direction to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier, wherein each lifting force of the plurality of lifting forces being applied at a corresponding lifting location of the plurality of sequential lifting locations after the first debond front has propagated past the corresponding lifting location of the first carrier, to thereby continuously peel without ceasing to peel the first carrier from the substrate, until the first carrier is completely separated from the substrate.