Y10S 156/942
With reorientation means
Official title: with reorientation means
Y10S156/942 (With reorientation means) appears on 48 US grants and 22 published applications in this corpus.
Search patents in Y10S- Granted patents
- 48
- Published applications
- 22
- Assignees
- 28
- Inventors
- 74
- Latest grant
- 9 Nov 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 7 | 4 |
| 2002 | 1 | 3 |
| 2003 | 5 | 2 |
| 2004 | 5 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 2 |
| 2012 | 2 | 1 |
| 2013 | 0 | 1 |
| 2014 | 3 | 1 |
| 2015 | 3 | 3 |
| 2016 | 2 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus for manufacturing element array and apparatus for removing specific element9 Nov 2021US 11,167,541 B2TDK Corporation
- Method of manufacturing element array and method of removing specific element24 Aug 2021US 11,101,317 B2TDK Corporation
- Device for stripping a product substrate from a carrier substrate5 Jul 2016US 9,381,732 B2EV Group GmbH
- Method for thermal-slide debonding of temporary bonded semiconductor wafers8 Mar 2016US 9,281,229 B2Suss Microtec Lithography GmbH
- Method for stripping a product substrate from a carrier substrate17 Nov 2015US 9,186,877 B2EV Group GmbH
- Method of manufacturing element array and method of removing specific element16 Jul 2020US 2020/0227468 A1TDK Corporation
- Apparatus for manufacturing element array and apparatus for removing specific element9 Jul 2020US 2020/0215809 A1TDK Corporation
- Method for stripping a product substrate from a carrier substrate9 Apr 2015US 2015/0096690 A1EV Group GmbH
- Method for thermal-slide debonding of temporary bonded semiconductor wafers26 Mar 2015US 2015/0083342 A1Suss Microtec Lithography GmbH
- Device for stripping a product substrate from a carrier substrate19 Mar 2015US 2015/0075725 A1EV Group GmbH
Most cited
By later US patents
- Transfer adhesive dispensing device80US 3,969,181 AMinnesota Mining and Manufacturing Company · 1976
- Fixture for securing an adhesive attachment to a substrate78US 4,822,656 APhysical Systems, Inc. · 1989
- Component supply method71US 5,534,102 AMurata Manufacturing Co., Ltd. · 1996
- Method of producing semiconductor thin film and method of producing solar cell using same69US 6,802,926 B2Canon Kabushiki Kaisha · 2004
- Manipulation and handling of integrated circuit dice53US 4,915,565 ASGS-Thomson Microelectronics S.A. · 1990