Apparatus for manufacturing element array and apparatus for removing specific element
AssigneeTDK Corporation
InventorsToshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
Life of this patent
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Abstract
An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.
Claims18
An apparatus for manufacturing an element array comprising:
- a substrate hold means for holding a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle;
- a laser radiation device for radiating a laser to a specific element among the elements attached on the adhesive layer to remove the specific element from the adhesive layer;
- a collection mechanism disposed below the substrate and configured to receive the specific element removed from the adhesive layer by the laser radiation device;
- and
- a movement mechanism for moving the substrate in a two-dimensional direction along a surface substantially perpendicular to a radiation direction of the laser emitted from the laser radiation device.
An apparatus for removing a specific element comprising:
- a substrate hold means for holding a substrate including an adhesive layer on which elements are arranged in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle;
- a laser radiation device for radiating a laser to a specific element among the elements attached on the adhesive layer to remove the specific element from the adhesive layer;
- a collection mechanism disposed below the substrate and configured to receive the specific element removed from the adhesive layer by the laser radiation device;
- and
- a movement mechanism for moving the substrate in two-dimensional direction along a surface substantially perpendicular to a radiation direction of the laser emitted from the laser radiation device.
An apparatus for manufacturing an element array comprising:
- a substrate hold portion including an installation stand configured to detachably hold a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle;
- a laser radiation device configured to radiate a laser to a specific element among the elements attached on the adhesive layer to remove the specific element from the adhesive layer;
- a collection mechanism disposed below the substrate and including an opening for receiving the specific element removed from the adhesive layer by the laser radiation;
- and
- a movement portion having a mechanism that is configured to move the substrate relatively in a two-dimensional direction along a surface substantially perpendicular to a radiation direction of the laser emitted from the laser radiation device.
An apparatus for removing a specific element comprising:
- a substrate hold portion including an installation stand configured to detachably hold a substrate including an adhesive layer on which elements are arranged in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle;
- a laser radiation device configured to radiate a laser to a specific element among the elements attached on the adhesive layer to remove the specific element from the adhesive layer;
- a collection mechanism disposed below the substrate and including an opening for receiving the specific element removed from the adhesive layer by the laser radiation;
- and
- a movement portion having a mechanism that is configured to move the substrate relatively in a two-dimensional direction along a surface substantially perpendicular to a radiation direction of the laser emitted from the laser radiation device.
Dependencies are inferred from the claim text.