Component supply method
AssigneeMurata Manufacturing Co., Ltd.
InventorsNobuaki Kadono, Kenichirou Kidou
Life of this patent
Estimating the term…
Abstract
A component supply method includes the steps of sticking an adhesive sheet, which is provided on its upper surface with a first foam releasable adhesive layer whose adhesion, can be reduced by heating, onto an upper surface of a pallet having a side surface serving as a reference portion, sticking a wafer onto the upper surface of the adhesive sheet, cutting the wafer for obtaining a number of components, reducing the adhesion of the first adhesive layer by heating, and taking out the individual components, obtained by cutting the wafer, from the pallet. In the steps of sticking the adhesive sheet, sticking the wafer and taking out the components, the elements are located on the basis of the side surface of the pallet serving as a reference portion.
Claims16
A component supply method comprising the steps of:
- providing a pallet having a reference portion comprising side surfaces of the pallet used for locating objects to be mounted on said pallet for processing;
- providing an adhesive sheet formed by a base material having a first surface, a second surface, a first adhesive layer made of a foam releasable adhesive and located on said first surface, and a second adhesive layer located on said second surface, said first adhesive layer being capable of having its adhesion reduced by heating, said second adhesive layer not being capable of having its adhesion reduced by heating or only being capable of having its adhesion reduced by an amount less than said first adhesive layer by heating;
- sticking said adhesive sheet onto a surface of said pallet while aligning said adhesive sheet to have a predetermined positional relation with respect to said reference portion of said pallet;
- sticking a wafer onto said first adhesive layer of said adhesive sheet while aligning said wafer to have a predetermined positional relation with respect to said reference portion of said pallet;
- cutting said wafer on the basis of said reference portion thereby obtaining individual components;
- reducing adhesion of said first adhesive layer by heating;
- positioning the individual components by moving a movable guide member into contact with the side surfaces of the pallet to move the side surfaces of the pallet into contact with a fixed guide member;
- and
- removing said individual components from said first adhesive layer on the basis of said reference portion.
A component supply method comprising the steps of:
- providing a pallet having a reference portion used for locating objects to be mounted on said pallet for processing;
- providing an adhesive sheet formed by a base material having a first surface, a second surface, a first adhesive layer made of a foam releasable adhesive and located on said first surface, and a second adhesive layer located on said second surface, said first adhesive layer being capable of having its adhesion reduced by heating, said second adhesive layer not being capable of having its adhesion reduced by heating or only being capable of having its adhesion reduced by an amount less than said first adhesive layer by heating;
- sticking said adhesive sheet onto a surface of said pallet while aligning said adhesive sheet to have a predetermined positional relation with respect to said reference portion of said pallet;
- sticking a wafer onto said first adhesive layer of said adhesive sheet while aligning said wafer to have a predetermined positional relation with respect to said reference portion of said pallet;
- cutting said wafer on the basis of said reference portion thereby obtaining individual components;
- reducing adhesion of said first adhesive layer by heating;
- and
- removing said individual components from said first adhesive layer on the basis of said reference portion.
Dependencies are inferred from the claim text.