Methods for making spring interconnect structures
AssigneeFormFactor, Inc.
InventorsGaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube
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Abstract
A method including fabricating a multi-tiered structure to form a compact, resilient interconnect structure. Fabricating each tier or leaf includes, in one aspect, providing a base substrate material, and applying a masking material over the base substrate material. An opening is patterned in the masking material and a resilient element is formed in the opening. A resilient element is coupled to the resilient element to form the resulting product. The method includes repeating this process one or more times to fabricate a chip-level interconnection element. The interconnection element fabricated, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
Claims39
A method of forming an electrical interconnect element, said method comprising the steps of:
- forming a tip structure;
- forming a conductive cantilever beam structure comprising a plurality of leaf portions, there being a separating space between portions of adjacent leaves;
- forming a post structure;
- joining said cantilever beam structure and said post structure;
- and
- joining said cantilever beam structure and said tip structure.
A method of populating an electronic component with a plurality of interconnect elements, said method comprising the steps of:
- forming a plurality of tip structures;
- forming a plurality of conductive cantilever beam structures each comprising a plurality of leaf portions, there being a separating space between portions of adjacent leaves;
- forming a plurality of post structures;
- joining one of each said cantilever beam structures and one of each of said post structures;
- joining one of each of said cantilever beam structures and one of each of said tip structures;
- and
- joining each of said post structures to a terminal of said electronic component.
Dependencies are inferred from the claim text.