Y10S 148/028
Dicing
Y10S148/028 (Dicing) appears on 93 US grants and 3 published applications in this corpus.
Search patents in Y10S- Granted patents
- 93
- Published applications
- 3
- Assignees
- 49
- Inventors
- 173
- Latest grant
- 6 Nov 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 8 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 6 | 0 |
| 1997 | 14 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Nitride compound semiconductor element and method for manufacturing same6 Nov 2012US 8,306,085 B2Panasonic Corporation
- Nitride compound semiconductor element and method for manufacturing same18 Oct 2011US 8,039,283 B2Panasonic Corporation
- Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers6 Jan 2004US 6,673,699 B2ADC Telecommunications, Inc.
- Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers17 Sep 2002US 6,451,120 B1ADC Telecommunications, Inc.
- Method of manufacturing semiconductor acceleration sensor26 Sep 2000US 6,124,148 ASeiko Instruments R&D Center Inc.
- Nitride compound semiconductor element and method for manufacturing same5 Jan 2012US 2012/0002693 A1Panasonic Corporation
- Nitride compound semiconductor element and method for manufacturing same9 Sep 2010US 2010/0226401 A1Panasonic Corporation
- Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers26 Dec 2002US 2002/0197757 A1ADC Telecommunications, Inc.
Most cited
By later US patents
- Method for coplanar integration of semiconductor ic devices408US 4,990,462 AAdvanced Micro Devices, Inc. · 1991
- Methods for precise definition of integrated circuit chip edges147US 5,691,248 AInternational Business Machines Corporation · 1997
- Method of manufacturing semiconductor device139US 5,593,926 ASumitomo Electric Industries, Ltd. · 1997
- Wafer scribe technique using laser by forming polysilicon128US 5,543,365 ATexas Instruments Incorporated · 1996
- Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips106US 4,978,639 AAvantek, Inc. · 1990