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US 5,543,365 AGranted
Wafer scribe technique using laser by forming polysilicon
AssigneeTexas Instruments Incorporated
InventorsKendall S. Wills, Paul A. Rodriguez, Melvin Brewer
Life of this patent
Estimating the term…
Abstract
A channel is formed in a wafer to fore descrite die. A portion of the wafer is heated in the channel. A portion of the heated portion is cooled to eliminate the uniform structure. The cooled portion is scribed to separate the die.
Claims12
A method for preventing cracks as a result of a scribing operation, comprising the steps of:
- forming a channel in a wafer to provide descrite die;
- heating a first portion of said wafer under the channel
- cooling a second portion of said first portion to form a polysilicon structure that eliminates the uniform structures of said wafer of silicon within the second portion;
- scribing said second portion in order to separate said die.
1 more element
A method for preventing cracks as a result of a scribing operation, comprising the steps of:
- forming a channel in a wafer to provide descrite die;
- heating a first portion of said wafer under the channel;
- heating a second portion of said wafer under the channel;
- cooling a third portion and fourth portion of said wafer of said first and second portion respectively to form a polysilicon structure within the first and second portion structure that eliminates the uniform structure of the wafer of silicon.
1 more element
A method for preventing cracks as a result of a descrite operation, comprising the steps of:
- forming a channel in a wafer to provide descrite die;
- heating a first portion of said wafer under the channel on a first side of said wafer;
- heating a second portion of said wafer on a second side of said wafer;
- and
- cooling a third portion of said second portion to form a polysilicon structure eliminates the uniform structure of said wafer of silicon within the third portion scribing said third portion in order to separate said die.
2 more elements
Dependencies are inferred from the claim text.