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AssigneeADC Telecommunications, Inc.
InventorsKevin J. Hubbard, Mark McElhinney, Scott W. Priddy, Paul E. Colombo
Estimating the term…
An apparatus and method for batch processing semiconductor lasers producing substantially contamination free laser bar end surfaces for optimal growth of end surface layers are provided. The method includes loading a laser cell comprising a plurality of laser bars and an empty cassette capable of holding a plurality of laser bars into a cleaving chamber and pumping the cleaving chamber down to a desired pressure. Next, a cleaving cycle is performed in which an end laser bar is cleaved off the laser cell. The laser bar is deposited in the cassette, while the laser cell is positioned for a subsequet operation. The cleaving cycle repeats until a plurality of laser bars are cleaved off the laser cell and loaded into the cassette. The cassette is then moved into a deposition chamber where a layer of material is deposited on at least one end surface of all of the laser bars in the cassette.
A method of batch processing semiconductor substrates in a process for making semiconductor lasers, the semiconductor lasers being formed from laser bars that are cleaved from a laser cell, each of the laser bars having oppositely facing side surfaces, the method comprising the steps of:
A method of processing a laser cell to form a plurality of individual laser bars having oppositely facing side surfaces and oppositely facing top and bottom surfaces such that the plurality of laser bars can be subsequently processed as a stacked batch, the method comprising the steps of:
Dependencies are inferred from the claim text.