Method for coplanar integration of semiconductor ic devices

A method for coplanar integration of semiconductor IC devices comprising:

• (a) providing segments having at least one edge having an abutting portion capable of abutting against a similar edge of a neighboring segment, each segment having thereon at least one of the items selected from the group consisting of circuits, circuit elements, and connectors;
• (b) arranging said segments on the surface of a flotation liquid;
• (c) allowing said segments to be pulled together so as to mate abutting edges of neighboring segments;
• (d) forming microbridges between neighboring segments by solidifying said flotation liquid;
• and
• (e) forming conductive interconnections between neighboring segments.

A method for coplanar integration of semiconductor IC devices comprising:

• (a) providing segments having at least one edge having an abutting portion capable of abutting against a similar edge of a neighboring segment, each segment having on a top surface thereof at least one of the items selected from the group consisting of circuits, circuit elements, sensors, and input/output connections;
• (b) forming wettable portions on said top surfaces which are made wettable to a flotation liquid;
• (c) placing said segments on a first surface such that said top surfaces of said segments are face up;
• (d) placing wetting drops of said flotation liquid such that said wettable portions of said top surface and said edges of each segment are wetted;
• (e) arranging a reference surface to contact said top of said segments in cowetted contact therewith;
• (f) urging said segments together so as to mate abutting edges of neighboring segments to form a superchip;
• (g) forming microbridges between neighboring segments to mechanically secure said superchip;
• and
• (h) forming electrical interconnections between neighboring segments so as to interconnect various of said of circuits, circuit elements, sensors, and input/output connections.

A method for coplanar integration of semiconductor IC devices comprising:

• (a) providing segments having at least one edge having an abutting portion capable of abutting against a similar edge of a neighboring segment, each segment having on a top surface thereof at least one of the items selected from the group consisting of circuits, circuit elements, sensors, and input/output connections;
• (b) placing said segments on a reference surface such that said top surfaces of said segments are face down to ensure coplanarity of said top surfaces;
• (c) placing a flotation liquid such that spaces between neighboring segments are substantially filled therewith and said edges of said segments are wetted;
• (d) allowing said segments to be drawn together so as to mate abutting edges of neighboring segments to form a superchip;
• (e) forming microbridges between neighboring segments to mechanically secure said superchip;
• and
• (f) forming electrical interconnections between neighboring segments so as to interconnect various of said of circuits, circuit elements, sensors, and input/output connections.