Method of manufacturing semiconductor acceleration sensor
AssigneeSeiko Instruments R&D Center Inc.
InventorsMasataka Shinogi, Yutaka Saitoh, Kenji Kato
Life of this patent
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Abstract
A method of manufacturing a semiconductor acceleration sensor comprises forming a strain sensing section on a surface of a semiconductor wafer, fixing the semiconductor wafer to a cooled fixing stage, cutting out a structural body having the strain sensing section from the semiconductor wafer, and connecting a support member to the structural body cut from the semiconductor wafer.
Claims15
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- forming strain sensing sections on a surface of a semiconductor wafer;
- fixing the semiconductor wafer to a cooled fixing stage;
- cutting out a rectangular parallelepiped structural body having one of the strain sensing sections from the semiconductor wafer;
- and
- joining a support member to the rectangular parallelepiped structural body cut out from the semiconductor wafer.
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- providing a semiconductor wafer having a strain sensing section for sensing an acceleration;
- disposing the semiconductor wafer on a fixing stage;
- cooling the fixing stage to fix the semiconductor wafer to the fixing stage;
- and cutting out a generally rectangular parallelepiped-shaped body having the strain sensing section from the semiconductor wafer.
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- providing a semiconductor wafer having a strain sensing section for sensing an acceleration;
- disposing the semiconductor wafer on a fixing stage;
- cooling the fixing stage to fix the semiconductor wafer to the fixing stage;
- cutting out a structural body having the strain sensing section from the semiconductor wafer;
- and connecting a support member to the structural body cut out from the semiconductor wafer.
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- providing a semiconductor wafer having a strain sensing section disposed on a surface portion thereof for sensing an acceleration and having diffusion resistors disposed in the surface portion of the semiconductor wafer;
- disposing the semiconductor wafer on a fixing stage;
- cooling the fixing stage to fix the semiconductor wafer to the fixing stage;
- and cutting out a structural body having the strain sensing section from the semiconductor wafer such that a dimension of the surface portion of the semiconductor wafer in a direction perpendicular to a longitudinal direction of the diffusion resistors is shorter than a thickness of the semiconductor wafer.
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- providing a semiconductor wafer having a strain sensing section for sensing an acceleration;
- disposing the semiconductor wafer on a fixing stage having a thermoelectric conversion element for cooling the fixing stage, the thermoelectric conversion element having a first surface for cooling the fixing stage and a second surface opposite the first surface;
- fixing the semiconductor wafer to the fixing stage by cooling the second surface of the thermoelectric conversion element using a heat dissipation member disposed over the first surface of the thermoelectric conversion element;
- and cutting out a structural body having the strain sensing section from the semiconductor wafer.
A method of manufacturing a semiconductor acceleration sensor, comprising the steps of:
- providing a semiconductor wafer having a strain sensing section for sensing an acceleration;
- disposing the semiconductor wafer on a fixing stage;
- cooling the fixing stage to fix the semiconductor wafer to the fixing stage;
- and cutting out a structural body having the strain sensing section from the semiconductor wafer by forming grooves in front and back surface portions of the semiconductor wafer and cutting out the structural body from the semiconductor wafer by forming a penetrating groove through the grooves in the front and back surface portions to penetrate the semiconductor wafer.
Dependencies are inferred from the claim text.