H10W 72/643
Not being orthogonal to a side surface of the chip
Official title: {not being orthogonal to a side surface of the chip, e.g. in fan-out arrangements}
H10W72/643 (Not being orthogonal to a side surface of the chip) appears on 15 US grants and 16 published applications in this corpus.
Search patents in H10W- Granted patents
- 15
- Published applications
- 16
- Assignees
- 10
- Inventors
- 22
- Latest grant
- 2 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 2 |
| 2014 | 2 | 0 |
| 2015 | 0 | 1 |
| 2016 | 2 | 4 |
| 2017 | 3 | 2 |
| 2018 | 1 | 1 |
| 2019 | 3 | 1 |
| 2020 | 1 | 3 |
| 2021 | 2 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year.
Recent patents
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- Semiconductor Package with Space Efficient Lead and Die Pad Design26 Nov 2020US 2020/0373228 A1Infineon Technologies AG
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Most cited
By later US patents
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- Semiconductor package with integrated output inductor on a printed circuit board3US 9,565,768 B2Infineon Technologies Americas Corp. · 2017
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