Package with elevated lead and structure extending vertically from encapsulant bottom

A method of manufacturing a package, wherein the method comprises:

• mounting an electronic component on a carrier;
• electrically coupling at least one lead with the electronic component;
• encapsulating at least part of the electronic component and at least part of the carrier by an encapsulant which has a bottom side at a first vertical level;
• encapsulating only a first lead portion of the at least one lead in the encapsulant so that a second lead portion of the at least one lead extends out of the encapsulant at said bottom side of the encapsulant;
• and
• forming a functional structure at said bottom side extending up to a second vertical level being different from said first vertical level, wherein the functional structure comprises at least one extension extending downwardly from said bottom side, wherein the second lead portion protrudes vertically beyond the at least one extension, wherein the at least one extension forms part of the encapsulant, and wherein a gap separates the at least one extension from the second lead portion.