Fan-out pop stacking process
AssigneeApple Inc.
InventorChih-Ming Chung
Life of this patent
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Abstract
Package on package structures and manners of formation are described. In an embodiment, an array of trenches is formed partially through a fan-out substrate. In an embodiment, a plurality of laterally separate locations thermal interface material is dispensed onto an array of embedded bottom die. In an embodiment a thermal compression tool including an array of cavities corresponding to an array of top packages is brought into contact with the array of top packages and underlying fan-out substrate during PoP joint formation. The fan-out substrate may be secured to a vacuum chuck during several processing operations.
Claims17
A method of forming a semiconductor device package comprising:
- forming an array of trenches partially through an active side of a fan-out substrate, wherein a second side of the fan-out substrate opposite the active side is supported by a carrier substrate during forming the array of trenches, and the fan-out substrate further comprises:
- a plurality of embedded bottom die on the carrier substrate and embedded within a polymer-based molding compound;
- and
- a redistribution layer spanning over the polymer-based molding compound and the plurality of embedded bottom die, wherein the redistribution layer includes a plurality of conductive lines that fan-out electrical connections with the plurality of embedded bottom die;
- removing the carrier substrate after forming the array of trenches partially through the active side of the fan-out substrate;
- and
- placing an array of top packages onto the second side the fan-out substrate after removing the carrier substrate.
Dependencies are inferred from the claim text.