Semiconductor module and semiconductor module manufacturing method

A semiconductor module, comprising:

• a laminated substrate that includes a heat radiating plate having a top surface and a bottom surface opposite to the top surface, and an insulation layer having a top surface and being disposed on the top surface of the heat radiating plate, the insulation layer having a conductive pattern on the top surface thereof;
• a semiconductor element disposed on a top surface of the conductive pattern;
• an integrated circuit that controls a driving of the semiconductor element;
• a control-side lead frame having a primary surface on which the integrated circuit is disposed;
• and
• a mold resin that seals the laminated substrate, the semiconductor element, the integrated circuit, and the control-side lead frame, wherein
• the control-side lead frame has a rod-shaped first pin having a first end, a first end side of the first pin extending toward the top surface of the heat radiating plate, and
• the heat radiating plate has at least one insertion hole, into one of which the first end of the first pin is press-fitted.