Semiconductor package with space efficient lead and die pad design

A method of packaging a semiconductor device, comprising:

• providing a die pad comprising a die attach surface, a rear surface opposite the die attach surface, and an outer edge side extending between the die attach surface and the rear surface, the outer edge side having a step-shaped profile wherein an upper section of the die pad laterally overhangs past a lower section of the die pad;
• mounting a semiconductor die on the die attach surface such that a first electrical terminal on an upper surface of the semiconductor die faces away from the die attach surface;
• and
• providing a first conductive clip that directly electrically contacts the first electrical terminal and wraps around the outer edge side of the die pad such that an outer end of the first conductive clip is at least partially within an area that is directly below the upper section of the die pad and directly laterally adjacent to the lower section.