H10W 70/699
For flat cards
Official title: {for flat cards, e.g. credit cards}
H10W70/699 (For flat cards) appears on 641 US grants and 580 published applications in this corpus.
Search patents in H10W- Granted patents
- 641
- Published applications
- 580
- Assignees
- 244
- Inventors
- 1,096
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 4 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 12 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 20 | 0 |
| 2001 | 27 | 12 |
| 2002 | 16 | 18 |
| 2003 | 20 | 21 |
| 2004 | 18 | 38 |
| 2005 | 13 | 36 |
| 2006 | 31 | 68 |
| 2007 | 42 | 59 |
| 2008 | 31 | 52 |
| 2009 | 28 | 38 |
| 2010 | 44 | 27 |
| 2011 | 31 | 33 |
| 2012 | 30 | 15 |
| 2013 | 26 | 14 |
| 2014 | 18 | 21 |
| 2015 | 16 | 13 |
| 2016 | 16 | 15 |
| 2017 | 18 | 18 |
| 2018 | 13 | 17 |
| 2019 | 23 | 12 |
| 2020 | 11 | 11 |
| 2021 | 11 | 4 |
| 2022 | 5 | 6 |
| 2023 | 5 | 14 |
| 2024 | 4 | 8 |
| 2025 | 7 | 5 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing contactless module having an antenna coil with finely adjustable inductance1 Sep 2026US 12,725,910 B2Sealsq France
- Chip module and method of forming same1 Sep 2026US 12,727,500 B2Act Identity Technology Limited
- Card having a fingerprint sensor and manufacturing method of the same7 Apr 2026US 12,596,902 B2Elan Microelectronics Corporation
- Package, method for forming a package, chip card, and method for forming a chip card24 Mar 2026US 12,588,150 B2Infineon Technologies AG
- Method for creating a document structure, and document structure17 Mar 2026US 12,576,664 B2Infineon Technologies AG
- Circuit board and chip package comprising same2 Jul 2026US 2026/0190224 A1LG Innotek Co., Ltd.
- Light-Emitting Electronic Module for a Chip Card25 Jun 2026US 2026/0176526 A1
- Smart ic substrate, smart ic module, and ic card comprising same7 May 2026US 2026/0130254 A1Korea University Research and Business Foundation
- Ic modules and ic cards12 Mar 2026US 2026/0073175 A1Toppan Holdings Inc.
- Ic modules and ic cards5 Mar 2026US 2026/0068727 A1Toppan Holdings Inc.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Enclosed transceiver404US 5,448,110 AMicron Communications, Inc. · 1995
- Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film369US 5,200,362 AMotorola, Inc. · 1993
- Overmolded semiconductor device having solder ball and edge lead connective structure334US 5,239,198 AMotorola, Inc. · 1993
- Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film334US 5,273,938 AMotorola, Inc. · 1993