Ic modules and ic cards
AssigneeToppan Holdings Inc.
InventorsShigenori TAKEDA, Shin Kataoka, Tetsuya Tsukada
Life of this patent
Estimating the term…
Abstract
The present invention is an IC module including: a substrate having a through hole; a contact terminal provided on a first surface of the substrate; an IC chip provided on a second surface of the substrate; a holding portion fixed to the substrate and projecting from the substrate; and a fingerprint sensor fixed to the holding portion, wherein the contact terminal is electrically connected to the IC chip via the through hole, and the fingerprint sensor is electrically connected to the IC chip via the holding portion.
Claims25
An IC module comprising:
- a substrate having a through hole penetrating in a plate thickness direction;
- a contact terminal provided on a first surface of the substrate facing a first side in the plate thickness direction;
- an IC chip provided on a second surface of the substrate facing a second side in the plate thickness direction;
- a holding portion fixed to the substrate and projecting from the substrate toward the second side in the plate thickness direction;
- and
- a fingerprint sensor fixed to the holding portion and disposed facing the IC chip with a gap therebetween in the plate thickness direction, wherein
- the contact terminal is electrically connected to the IC chip via the through hole, and
- the fingerprint sensor is electrically connected to the IC chip via the holding portion.
An IC module comprising:
- a substrate having a through hole penetrating in a plate thickness direction;
- a contact terminal provided on a first surface of the substrate facing a first side in the plate thickness direction;
- an IC chip provided on a second surface of the substrate facing a second side in the plate thickness direction;
- a holding portion fixed to the substrate and projecting from the substrate toward the second side in the plate thickness direction;
- and
- a fingerprint sensor fixed to the holding portion and disposed facing the IC chip with a gap therebetween in the plate thickness direction, wherein
- the IC chip includes a first IC chip and a second IC chip,
- the contact terminal is electrically connected to the first IC chip via the through hole, and
- the fingerprint sensor is electrically connected to the second IC chip via the holding portion.
The IC card of 10, wherein
- the coupling portion is a coil capable of being electromagnetically coupled to the booster antenna.
An IC module comprising:
- a first substrate having a first through hole penetrating in a plate thickness direction;
- a contact terminal fixed to a first surface of the first substrate facing a first side in the plate thickness direction via a conductive fixing portion;
- and
- an IC chip and a fingerprint sensor provided on a second surface of the first substrate facing a second side in the plate thickness direction, wherein
- the contact terminal is electrically connected to the IC chip via the fixing portion and the first through hole.
An IC module comprising:
- a first substrate having a first through hole penetrating in a plate thickness direction;
- a contact terminal fixed to a first surface of the first substrate facing a first side in the plate thickness direction via a conductive fixing portion;
- and
- an IC chip and a fingerprint sensor provided on a second surface of the first substrate facing a second side in the plate thickness direction, wherein
- the IC chip includes a first IC chip and a second IC chip,
- the contact terminal is electrically connected to the first IC chip via the fixing portion and the first through hole, and
- the fingerprint sensor is electrically connected to the second IC chip.
Dependencies are inferred from the claim text.