Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

A process for fabricating a semiconductor device comprising the steps of:

• providing a transfer film;
• providing a pattern of conductive traces on said transfer film, the pattern of traces having a first side and a second side;
• providing a first and a second semiconductor die;
• forming first electrical interconnections between the first side of the pattern of conductive traces and the first semiconductor die;
• providing a resin material on one side of the transfer film to form a first package body which encapsulates the first semiconductor die, the first electrical interconnections, and the first side of the pattern of conductive traces, the first package body having a bottom surface defined by the transfer film;
• removing said transfer film to expose the second side of the pattern of conductive traces on the bottom surface of the first package body;
• positioning the second semiconductor die on the bottom surface of the first package body;
• forming second electrical interconnections between the second side of the pattern of conductive traces and the second semiconductor die;
• and
• providing a resin material to form a second package body which encapsulates the second semiconductor die, the second electrical interconnections, and a first portion of the second side of the pattern of conductive traces such that a second portion of the second side of the pattern of conductive traces is exposed.