H10W 40/037
Assembling together parts thereof
Official title: {Assembling together parts thereof}
H10W40/037 (Assembling together parts thereof) appears on 1,295 US grants and 1,792 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,295
- Published applications
- 1,792
- Assignees
- 537
- Inventors
- 3,090
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 8 | 0 |
| 1998 | 17 | 0 |
| 1999 | 7 | 0 |
| 2000 | 11 | 0 |
| 2001 | 12 | 3 |
| 2002 | 14 | 20 |
| 2003 | 15 | 19 |
| 2004 | 15 | 16 |
| 2005 | 12 | 27 |
| 2006 | 14 | 35 |
| 2007 | 9 | 29 |
| 2008 | 16 | 24 |
| 2009 | 15 | 30 |
| 2010 | 12 | 25 |
| 2011 | 11 | 30 |
| 2012 | 9 | 19 |
| 2013 | 20 | 43 |
| 2014 | 16 | 59 |
| 2015 | 29 | 71 |
| 2016 | 75 | 105 |
| 2017 | 86 | 131 |
| 2018 | 113 | 114 |
| 2019 | 107 | 102 |
| 2020 | 95 | 145 |
| 2021 | 90 | 121 |
| 2022 | 100 | 119 |
| 2023 | 98 | 119 |
| 2024 | 75 | 156 |
| 2025 | 95 | 125 |
| 2026 | 63 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Multi-tim packages and method forming same1 Oct 2026US 2026/0305332 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and manufacturing method thereof24 Sep 2026US 2026/0293669 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Fin design molding structure for exposed semiconductor package for convection heat transfer17 Sep 2026US 2026/0282899 A1Micron Technology, Inc.
Most cited
By later US patents
- Packaged semiconductor die including heat sink with locking feature288US 5,701,034 AAmkor Electronics, Inc. · 1997
- Thermal management system106US 6,482,520 B12002
- Ground plane for plastic encapsulated integrated circuit die packages96US 5,068,708 AAdvanced Micro Devices, Inc. · 1991
- Graphite-based heat sink94US 6,503,626 B1Graftech Inc. · 2003
- Heat sink design integrating interface material87US 5,168,926 AIntel Corporation · 1992