Multi-tim packages and method forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
Life of this patent
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Abstract
A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, an and attaching heat sink over both of the first thermal interface material and the second thermal interface material.
Claims20
A package comprising:
- a package component comprising:
- a first device die;
- a second device die;
- an underfill between and contacting the first device die and the second device die;
- and
- an encapsulant encapsulating the first device die and the second device die therein;
- a thermal interface material comprising:
- a first portion over and contacting the first device die;
- a second portion over and contacting the second device die;
- and
- a third portion between the first portion and the second portion, wherein the third portion is thinner than the first portion and the second portion;
- a filling material overlapping the first portion;
- and
- a heat sink over and contacting the thermal interface material.
A package comprising:
- a first package component;
- a second package component over and bonding to the first package component;
- a third package component over and bonding to the first package component;
- an encapsulant encapsulating the second package component and the third package component therein;
- a first thermal interface material over and contacting the second package component;
- a second thermal interface material over and contacting the third package component, wherein the first thermal interface material and the second thermal interface material are portions of a continuous thermal interface material, and a groove is between the first thermal interface material and the second thermal interface material;
- and
- a heat sink over and in contact with both of the first thermal interface material and the second thermal interface material, wherein the heat sink forms a first interface in a cross-section of the package, and wherein the first interface extends from the groove to an edge of the encapsulant.
A package comprising:
- a first device die;
- a second device die, wherein the first device die is spaced apart from the second device die by an intermediate region;
- and
- a thermal interface material comprising:
- a first portion over and contacting the first device die, wherein the first portion comprises a planar top surface that extends laterally from a first side of the first device die to substantially a second side of the first device die, wherein the first side and the second side are opposite sides of the first device die;
- a second portion over and contacting the second device die, wherein the first portion and the second portion have a first thickness;
- and
- a third portion connecting the first portion to the second portion, wherein the third portion has a second thickness smaller than the first thickness, wherein the third portion overlaps the intermediate region.
Dependencies are inferred from the claim text.