Fin design molding structure for exposed semiconductor package for convection heat transfer

A semiconductor device assembly, comprising:

• a circuit substrate;
• a first die stack arranged on, and electrically coupled to, the circuit substrate, the first die stack comprising a first plurality of semiconductor dies that include a first bottom semiconductor die arranged proximate to the circuit substrate and a first upper semiconductor die arranged away from the circuit substrate;
• a second die stack arranged on, and electrically coupled to, the circuit substrate, the second die stack comprising a second plurality of semiconductor dies that include a second bottom semiconductor die arranged proximate to the circuit substrate and a second upper semiconductor die arranged away from the circuit substrate;
• a heat transfer layer arranged on the first upper semiconductor die and the second upper semiconductor die, wherein the heat transfer layer is configured to transfer heat generated by the first die stack and the second die stack away from the first die stack and the second die stack;
• and
• a package casing arranged over the circuit substrate to partially encapsulate the first die stack, the second die stack, and the heat transfer layer,
• wherein the package casing includes a plurality of fin structures and a plurality of channels arranged over the heat transfer layer,
• wherein the plurality of channels are defined by the plurality of fin structures,
• wherein the plurality of channels extend from an ambient environment into the package casing to the heat transfer layer to expose portions of the heat transfer layer to the ambient environment, and
• wherein the plurality of channels are configured to receive, from the heat transfer layer, the heat generated by the first die stack and the second die stack, and dissipate the heat into the ambient environment, away from the heat transfer layer and the package casing.

A method of manufacturing a semiconductor device assembly, the method comprising:

• arranging a semiconductor die on a circuit substrate, the semiconductor die having a first die surface that faces away from the circuit substrate, and a second die surface that faces toward the circuit substrate;
• arranging a heat transfer layer on the first die surface, wherein the heat transfer layer is configured to transfer heat generated by the semiconductor die away from the semiconductor die;
• encapsulating the semiconductor die and the heat transfer layer within a package casing;
• and
• forming a plurality of fin structures and a plurality of channels, at an upper region of the package casing, over the heat transfer layer,
• wherein the plurality of channels are defined by the plurality of fin structures,
• wherein the plurality of channels extend from an ambient environment into the package casing to the heat transfer layer to expose portions of the heat transfer layer to the ambient environment, and
• wherein the plurality of channels are configured to receive, from the heat transfer layer, the heat generated by the semiconductor die, and dissipate the heat into the ambient environment, away from the heat transfer layer and the package casing.