H10W 20/483
Interconnections over air gaps
Official title: {Interconnections over air gaps, e.g. air bridges}
H10W20/483 (Interconnections over air gaps) appears on 247 US grants and 213 published applications in this corpus.
Search patents in H10W- Granted patents
- 247
- Published applications
- 213
- Assignees
- 98
- Inventors
- 493
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 1 |
| 2002 | 5 | 4 |
| 2003 | 4 | 3 |
| 2004 | 4 | 3 |
| 2005 | 3 | 6 |
| 2006 | 2 | 3 |
| 2007 | 4 | 6 |
| 2008 | 2 | 5 |
| 2009 | 1 | 5 |
| 2010 | 5 | 5 |
| 2011 | 3 | 2 |
| 2012 | 6 | 11 |
| 2013 | 6 | 9 |
| 2014 | 14 | 7 |
| 2015 | 11 | 19 |
| 2016 | 16 | 14 |
| 2017 | 13 | 18 |
| 2018 | 9 | 9 |
| 2019 | 22 | 8 |
| 2020 | 9 | 9 |
| 2021 | 6 | 15 |
| 2022 | 8 | 12 |
| 2023 | 8 | 12 |
| 2024 | 12 | 11 |
| 2025 | 9 | 16 |
| 2026 | 8 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereof11 Aug 2026US 12,707,962 B2Suzhou Institute of Nano-Tech and Nano-Bionics (Sinano) , Chinese Academy of Sciences
- Photodetector and beating spectroscopy device14 Jul 2026US 12,680,955 B2Hamamatsu Photonics K.K.
- Photodetector and beating spectroscopy device9 Jun 2026US 12,650,377 B2Hamamatsu Photonics K.K.
- Air gap seal for interconnect air gap and method of fabricating thereof2 Jun 2026US 12,648,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Radio frequency device and radio frequency front-end apparatus12 May 2026US 12,628,407 B2Xiamen Sanan Integrated Circuit Co., Ltd.
- Semiconductor device13 Nov 2025US 2025/0351479 A1Mitsubishi Electric Corporation
- Semiconductor structure with conductive structure6 Nov 2025US 2025/0343116 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Packaged device with air gap and methods of forming same6 Nov 2025US 2025/0343165 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Layout techniques and optimization for power transistors16 Oct 2025US 2025/0324711 A1MACOM Technology Solutions Holdings, Inc.
- Multi-die assemblies with glass support structures18 Sep 2025US 2025/0293122 A1Intel Corporation
Most cited
By later US patents
- Method of forming a semiconductor structure having an air region510US 5,324,683 AMotorola, Inc. · 1994
- Semiconductor device having a hollow around a gate electrode and a method for producing the same480US 5,559,046 AMatsushita Electronics Corporation · 1996
- Micro assembled LED displays and lighting elements254US 9,520,537 B2X-Celeprint Limited · 2016
- Semiconductor structure having an air region and method of forming the semiconductor structure162US 5,510,645 AMotorola, Inc. · 1996
- Micro assembled LED displays and lighting elements109US 9,437,782 B2X-Celeprint Limited · 2016