Multi-die assemblies with glass support structures

An assembly comprising:

• a substrate;
• a glass layer at a face of the substrate;
• a first conductive structure in the substrate, wherein an end of the first conductive structure is along the face of the substrate;
• and
• a second conductive structure extending within the glass layer, the second conductive structure directly coupled to the first conductive structure.

A device comprising:

• a substrate having a first side and a second side opposite the first side;
• an electronic component at the first side of the substrate;
• a bridge die in the substrate, the bridge die electrically coupled to the electronic component;
• a glass support at the second side of the substrate;
• and
• a via within the substrate, the via between the bridge die and the glass support, wherein the via has a first end having a first width and a second end having a second width, the first end of the via is closer to the glass support than the second end of the via, and the first width is greater than the second width.