H10W 10/019
Using epitaxial passivated integrated circuit [epic] processes
Official title: {using epitaxial passivated integrated circuit [EPIC] processes}
H10W10/019 (Using epitaxial passivated integrated circuit [epic] processes) appears on 181 US grants and 27 published applications in this corpus.
Search patents in H10W- Granted patents
- 181
- Published applications
- 27
- Assignees
- 64
- Inventors
- 255
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 5 | 0 |
| 1980 | 8 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 7 | 0 |
| 1986 | 15 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 13 | 0 |
| 1993 | 8 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 1 |
| 2002 | 4 | 4 |
| 2003 | 5 | 2 |
| 2004 | 0 | 2 |
| 2005 | 1 | 0 |
| 2006 | 2 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 1 |
| 2017 | 1 | 3 |
| 2018 | 1 | 0 |
| 2019 | 3 | 4 |
| 2020 | 3 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 3 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same27 Jan 2026US 12,538,836 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Seal ring structure with zigzag patterns and method forming same10 Sep 2024US 12,087,648 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Field-effect transistors with a crystalline body embedded in a trench isolation region2 Jan 2024US 11,862,511 B2GLOBALFOUNDRIES U. S. Inc.
- Nanosheet structure with isolated gate9 Jun 2020US 10,679,890 B2International Business Machines Corporation
- Isolation enhancement with on-die slot-line on power/ground grid structure11 Feb 2020US 10,559,561 B2Xilinx, Inc.
- Seal ring structure with zigzag patterns and method forming same7 May 2026US 2026/0130277 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Seal Ring Structure with Zigzag Patterns and Method Forming Same31 Oct 2024US 2024/0363457 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Field-effect transistors with a crystalline body embedded in a trench isolation region18 May 2023US 2023/0154786 A1GLOBALFOUNDRIES U. S. Inc.
- Seal Ring Structure with Zigzag Patterns and Method Forming Same2 Mar 2023US 2023/0066360 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof9 Feb 2023US 2023/0043874 A1Changxin Memory Technologies, Inc.
Most cited
By later US patents
- Semiconductor integrated circuit unit182US 5,412,558 AHitachi Haramachi Semiconductor Ltd. · 1995
- Dielectrically isolated semiconductor devices89US 4,501,060 AAT&T Bell Laboratories · 1985
- Semiconductor integrated circuit structure with insulative partitions76US 4,860,081 AGTE Laboratories Incorporated · 1989
- Method of fabricating a dielectric isolated area71US 5,091,330 AMotorola, Inc. · 1992
- High breakdown voltage semiconductor device66US 5,241,210 AKabushiki Kaisha Toshiba · 1993