Isolation enhancement with on-die slot-line on power/ground grid structure
AssigneeXilinx, Inc.
InventorsZhaoyin D. Wu, Parag Upadhyaya, Kun-Yung Chang
Life of this patent
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Abstract
Examples herein describe techniques for isolating portions of an IC that include sensitive components (e.g., inductors or capacitors) from return current in a grounding plane. An output current generated by a transmitter or driver in an IC can generate a magnetic field which induces return current in the grounding plane. If the return current is proximate the sensitive components, the return current can inject noise which can negatively impact other components in the IC. To isolate the sensitive components from the return current, embodiments herein include forming slots through the grounding structure which includes the grounding plane on one or more sides of the sensitive components.
Claims19
An integrated circuit, comprising:
- a grounding structure;
- a source;
- a transmitter, wherein, when the transmitter is active, return current flows through the grounding structure from the source to the transmitter;
- a passive component disposed between the source and the transmitter;
- a first slot extending through the grounding structure, wherein the first slot is between the passive component and the source;
- and
- a second slot extending through the grounding structure, wherein the second slot is between the passive component and the transmitter, wherein respective first ends of the first and second slots terminate at an edge of the grounding structure.
An integrated circuit, comprising:
- a grounding structure;
- a source;
- a sink, wherein return current flows through the grounding structure from the source to the sink;
- an inductor disposed between the source and the sink;
- and
- a first slot extending through the grounding structure, wherein the first slot is between the inductor and the source, wherein a first end of the first slot terminates at an edge of the grounding structure.
A method of fabricating an integrated circuit, the method comprising:
- forming a source in the integrated circuit;
- forming a transmitter in the integrated circuit;
- forming a grounding structure over an active region of a semiconductor substrate, wherein, when the transmitter is active, return current flows through the grounding structure from the source to the transmitter;
- forming a passive component disposed between the source and the transmitter;
- forming a first slot extending through the grounding structure, wherein the first slot is between the passive component and the source;
- and
- forming a second slot extending through the grounding structure, wherein the second slot is between the passive component and the transmitter, wherein respective first ends of the first and second slots terminate at an edge of the grounding structure.
Dependencies are inferred from the claim text.