Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same

A structure comprising:

• a die comprising:
• a first edge and a second edge joined to each other at a corner of the die;
• a metal ring comprising:
• a first edge portion and a second edge portion proximate the first edge and the second edge, respectively, wherein the first edge portion comprises:
• a first section parallel to the first edge, wherein the first section is spaced apart from the first edge by a first distance;
• a second section parallel to the first edge, wherein the second section is spaced apart from the first edge by a second distance different from the first distance;
• and
• an interconnection section interconnecting, and physically joining, the first section and the second section;
• and
• a via ring comprising a third section and a fourth section underlying and physically joined to the first section and the second section, respectively.

A structure comprising:

• a semiconductor substrate comprising a plurality of edges connected to form a rectangle in a top view of the structure;
• a via ring over the semiconductor substrate, wherein the via ring comprises a first plurality of edge portions parallel to respective ones of the plurality of edges of the semiconductor substrate;
• and
• a metal ring over and contacting the via ring, wherein the metal ring comprises a second plurality of edge portions, and wherein one of the second plurality of edge portions comprises:
• a first portion parallel to one of the plurality of edges of the semiconductor substrate;
• and
• a second portion forming an angle with the first portion in the top view of the structure, wherein the angle is greater than zero degree and smaller than 90 degrees.