H10P 95/112
Leaving a reusable substrate
Official title: {leaving a reusable substrate, e.g. epitaxial lift off}
H10P95/112 (Leaving a reusable substrate) appears on 285 US grants and 329 published applications in this corpus.
Search patents in H10P- Granted patents
- 285
- Published applications
- 329
- Assignees
- 155
- Inventors
- 571
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 4 |
| 2003 | 4 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 5 |
| 2008 | 4 | 4 |
| 2009 | 2 | 8 |
| 2010 | 6 | 7 |
| 2011 | 5 | 8 |
| 2012 | 3 | 6 |
| 2013 | 9 | 15 |
| 2014 | 12 | 16 |
| 2015 | 21 | 21 |
| 2016 | 19 | 15 |
| 2017 | 16 | 26 |
| 2018 | 18 | 22 |
| 2019 | 27 | 21 |
| 2020 | 17 | 25 |
| 2021 | 18 | 24 |
| 2022 | 13 | 22 |
| 2023 | 23 | 28 |
| 2024 | 13 | 17 |
| 2025 | 22 | 19 |
| 2026 | 7 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip bonding system and chip bonding method25 Aug 2026US 12,721,104 B2Bondtech Co., Ltd.
- Coupon wafer and method of preparation thereof14 Jul 2026US 12,681,236 B2Rockley Photonics Limited
- Coupon wafer and method of preparation thereof26 May 2026US 12,638,637 B2Rockley Photonics Limited
- Lift-off method14 Apr 2026US 12,604,714 B2Disco Corporation
- Semiconductor structure and manufacturing method of the same24 Mar 2026US 12,588,235 B2Vanguard International Semiconductor Corporation
- Method for producing led mounting substrate, cleaning solution, and cleaning method6 Aug 2026US 2026/0231711 A1Shin-Etsu Chemical Co., Ltd.
- Semiconductor Exfoliation Method16 Jul 2026US 2026/0206553 A1ThinSiC Inc.
- Semiconductor device, semiconductor device manufacturing method, and substrate reusing method4 Jun 2026US 2026/0157156 A1Kioxia Corporation
- Method for manufacturing semiconductor device21 May 2026US 2026/0144025 A1Kioxia Corporation
- Method for determining debonding parameter value and debonding method using debonding parameter value30 Apr 2026US 2026/0123356 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Apparatus for fabricating self-assembling microstructures356US 5,904,545 AThe Regents of the University of California · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011