H10P 76/2049
Ion beam lithography processes
Official title: {Ion beam lithography processes}
H10P76/2049 (Ion beam lithography processes) appears on 26 US grants and 25 published applications in this corpus.
Search patents in H10P- Granted patents
- 26
- Published applications
- 25
- Assignees
- 25
- Inventors
- 96
- Latest grant
- 7 May 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 2 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 2 | 2 |
| 2016 | 1 | 2 |
| 2017 | 2 | 1 |
| 2018 | 2 | 2 |
| 2019 | 2 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 3 |
| 2022 | 0 | 2 |
| 2023 | 2 | 0 |
| 2024 | 1 | 1 |
| 2025 | 0 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Forming contact holes with controlled local critical dimension uniformity7 May 2024US 11,978,631 B2Tokyo Electron Limited
- Material for forming organic film, method for forming organic film, patterning process, and compound21 Nov 2023US 11,822,247 B2Shin-Etsu Chemical Co., Ltd.
- Fabrication of high-aspect ratio nanostructures by localized nanospalling effect18 Jul 2023US 11,703,764 B2Khalifa University of Science and Technology
- Particle prevention method in lithography exposure apparatus14 Sep 2021US 11,119,420 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Pattern forming method30 Jul 2019US 10,366,888 B2Tokyo Electron Limited
- Ion implantation and vacuum bake of extreme ultraviolet photoresist to improve fine patterning performance18 Jun 2026US 2026/0173826 A1APPLIED Materials.Inc.
- Photoresist underlayer materials and associated methods27 Nov 2025US 2025/0362603 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing laminate and method for producing semiconductor element13 Nov 2025US 2025/0348001 A1Nissan Chemical Corporation
- Photoresist underlayer materials and associated methods13 Mar 2025US 2025/0085631 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ion beam lithography and nanoengineering4 Jul 2024US 2024/0222073 A1Intel Corporation
Most cited
By later US patents
- Method for forming pillar memory cells and device formed thereby156US 6,096,598 AInternational Business Machines Corporation · 2000
- Sequential infiltration synthesis for advanced lithography93US 8,980,418 B2Uchicago Argonne, LLC · 2015
- Printing sublithographic images using a shadow mandrel and off-axis exposure25US 6,194,268 B1International Business Machines Corporation · 2001
- Lithography mask and fabrication method thereof18US 5,770,336 ALG Semicon Co., Ltd. · 1998
- Production method of an HEMT semiconductor device16US 5,300,445 AMitsubishi Denki Kabushiki Kaisha · 1994