Pattern forming method
AssigneesTokyo Electron Limited, Tokyo Ohka Kogyo Co., Ltd.
InventorsKazuki Yamada, Masatoshi Yamato, Hidetami Yaegashi, Yoshitaka Komuro, Takehiro Seshimo, Katsumi Ohmori
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AssigneesTokyo Electron Limited, Tokyo Ohka Kogyo Co., Ltd.
InventorsKazuki Yamada, Masatoshi Yamato, Hidetami Yaegashi, Yoshitaka Komuro, Takehiro Seshimo, Katsumi Ohmori
Estimating the term…
A pattern forming method includes forming a first organic film by coating an etching target film with a composition including a polymer including a cross-linkable component, infiltrating an inorganic substance into the first organic film, cross-linking the polymer, forming a second organic film on the first organic film, forming a second organic film pattern by patterning the second organic film, forming a first organic film pattern having a pitch reduced to one-half of a pitch of the second organic film pattern by patterning the first organic film by a self-aligned patterning method that uses the second organic film pattern as a core pattern, forming an etching target film pattern having a pitch reduced to one-half of a pitch of the first organic film pattern by patterning the etching target film by a self-aligned patterning method that uses the first organic film pattern as a core pattern.
A pattern forming method comprising steps of:
Dependencies are inferred from the claim text.