H10P 72/1922
Characterised by the construction of the closed carrier
Official title: {characterised by the construction of the closed carrier}
H10P72/1922 (Characterised by the construction of the closed carrier) appears on 464 US grants and 482 published applications in this corpus.
Search patents in H10P- Granted patents
- 464
- Published applications
- 482
- Assignees
- 189
- Inventors
- 899
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 12 | 0 |
| 1999 | 10 | 0 |
| 2000 | 4 | 0 |
| 2001 | 14 | 3 |
| 2002 | 9 | 14 |
| 2003 | 7 | 9 |
| 2004 | 3 | 15 |
| 2005 | 6 | 9 |
| 2006 | 11 | 21 |
| 2007 | 7 | 8 |
| 2008 | 10 | 10 |
| 2009 | 4 | 12 |
| 2010 | 5 | 7 |
| 2011 | 5 | 8 |
| 2012 | 13 | 11 |
| 2013 | 7 | 15 |
| 2014 | 8 | 13 |
| 2015 | 9 | 16 |
| 2016 | 7 | 9 |
| 2017 | 11 | 27 |
| 2018 | 22 | 24 |
| 2019 | 29 | 29 |
| 2020 | 32 | 30 |
| 2021 | 21 | 38 |
| 2022 | 19 | 36 |
| 2023 | 24 | 38 |
| 2024 | 36 | 31 |
| 2025 | 38 | 31 |
| 2026 | 19 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Frame cassette with internal cover cases6 Oct 2026US 12,757,677 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging unit and transportation container6 Oct 2026US 12,757,678 B2Sumco Corporation
- Module tray for semiconductor device29 Sep 2026US 12,751,243 B2Samsung Electronics Co., Ltd.
- Substrate storing container and lid-body-side substrate support part22 Sep 2026US 12,745,597 B2Miraial Co., Ltd.
- Calibration pod for robotic wafer carrier handling and calibration performed using same1 Sep 2026US 12,727,429 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method of offset inspection1 Oct 2026US 2026/0305231 A1Gudeng Precision Industrial Co., Ltd.
- Substrate storage container and method for manufacturing substrate storage container17 Sep 2026US 2026/0282818 A1Shin-Etsu Polymer Co., Ltd.
- Front opening unified pod for containing square substrates and circular substrates10 Sep 2026US 2026/0271662 A1Stek Co., Ltd.
- Wet cleaning method for the door of foup30 Jul 2026US 2026/0216763 A1Asia Neo Tech Industrial Co., Ltd.
- Air curtain device9 Jul 2026US 2026/0194245 A1Gudeng Equipment Co., Ltd.
Most cited
By later US patents
- Wafer handling system486US 6,981,832 B2ASM International N.V. · 2006
- Wafer container358US 5,611,448 AUnited Microelectronics Corp. · 1997
- Container for vacuum storing and/or shipping silicon wafers346US 4,886,162 ASGS-Thomson Microelectronics S.A. · 1989
- Transport container with an interchangeable inside container326US 4,804,086 ASiemens Aktiengesellschaft · 1989
- Coupling system286US 9,281,223 B2National Institute of Advanced Industrial Science and Technology · 2016