H10P 72/0478
The substrates being processed being not semiconductor wafers
Official title: {the substrates being processed being not semiconductor wafers, e.g. leadframes or chips}
H10P72/0478 (The substrates being processed being not semiconductor wafers) appears on 191 US grants and 192 published applications in this corpus.
Search patents in H10P- Granted patents
- 191
- Published applications
- 192
- Assignees
- 114
- Inventors
- 505
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 6 |
| 2002 | 12 | 7 |
| 2003 | 7 | 15 |
| 2004 | 10 | 16 |
| 2005 | 11 | 15 |
| 2006 | 3 | 18 |
| 2007 | 6 | 14 |
| 2008 | 8 | 13 |
| 2009 | 7 | 13 |
| 2010 | 9 | 14 |
| 2011 | 11 | 7 |
| 2012 | 7 | 7 |
| 2013 | 6 | 4 |
| 2014 | 5 | 4 |
| 2015 | 2 | 3 |
| 2016 | 8 | 4 |
| 2017 | 5 | 6 |
| 2018 | 3 | 3 |
| 2019 | 3 | 1 |
| 2020 | 2 | 3 |
| 2021 | 1 | 3 |
| 2022 | 3 | 5 |
| 2023 | 2 | 7 |
| 2024 | 5 | 1 |
| 2025 | 1 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Quick release assembly for a pressing head and electronic device testing apparatus having the same25 Nov 2025US 12,479,670 B2Chroma Ate Inc.
- Electronic device testing apparatus and electronic device testing method31 Dec 2024US 12,180,018 B2Chroma Ate Inc.
- Electronic device pick-and-place system and electronic device testing apparatus having the same1 Oct 2024US 12,103,789 B2Chroma Ate Inc.
- System configurations for fabrication of micro-LED displays13 Aug 2024US 12,062,735 B2APPLIED Materials.Inc.
- Miniature Electrostatic Chuck for Die-to-Substrate Bonding and Method for Manufacturing the Same7 May 2026US 2026/0130172 A1Inspiring Atoms Pte Ltd
- Thermal compression bonding with contact area adjustment28 Aug 2025US 2025/0273618 A1International Business Machines Corporation
- System and method for the multi-step processing of planar substrates12 Jun 2025US 2025/0187854 A1Schott AG
- Manufacturing equipment for light-emitting device6 Jun 2024US 2024/0186160 A1Semiconductor Energy Laboratory Co.Ltd.
- Photochemical and thermal release layer processes and uses in device manufacturing11 May 2023US 2023/0144598 A1Terecircuits Corporation
Most cited
By later US patents
- System for heat treatment of semiconductor device476US 7,989,736 B2Viatron Technologies Inc. · 2011
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Modular substrate processing system215US 6,235,634 B1Applied Komatsu Technology, Inc. · 2001
- Method of heating and cooling large area glass substrates184US 5,674,786 AAPPLIED Materials.Inc. · 1997
- Semiconductor device and manufacturing method thereof123US 6,387,737 B1Semiconductor Energy Laboratory Co.Ltd. · 2002