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US 2026/0130172 A1Published application
Miniature Electrostatic Chuck for Die-to-Substrate Bonding and Method for Manufacturing the Same
AssigneeInspiring Atoms Pte Ltd
InventorYang Pan
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Abstract
The present disclosure provides a miniature electrostatic chuck (ESC) for die-to-wafer (D2W) bonding. The ESC can be manufactured using conventional semiconductor processes, incorporating through-silicon-via (TSV) and through-dielectric-via (TDV) structures. The ESC with different sizes can be attached to and detached from a multi-axis robotic arm, allowing optimized D2W bonding processes.
Claims20
A bonding head system for handling semiconductor dies, comprising:
- a miniature ESC manufactured using a semiconductor manufacturing process, wherein the ESC includes a multi-layered structure comprising:
- a silicon layer;
- a bulk dielectric layer disposed on the silicon layer, providing electrical insulation;
- a surface dielectric layer disposed on the bulk dielectric layer;
- a conductive pathway formed through the silicon layer and the bulk dielectric layer, comprising TSVs and TDVs, configured to apply a DC bias voltage to electrodes below the surface dielectric layer to generate an electrostatic clamping force for holding one or more semiconductor dies;
- and
- a support structure configured to detachably hold the miniature ESC and to supply the bias voltage;
- wherein the support structure is connected to a moving mechanism and wherein the semiconductor manufacturing process enables flexibility in the size of the miniature ESC.
5 more elements
A method for manufacturing a miniature ESC for handling semiconductor dies, the method comprising:
- forming TSVs in a silicon wafer;
- depositing a bulk dielectric layer on the silicon wafer;
- forming TDVs and electrodes on the bulk dielectric layer;
- depositing a surface dielectric layer over the bulk dielectric layer;
- bonding the silicon wafer to a temporary substrate;
- conducting TSV revealing process and forming ESC contacts;
- debonding the temporary substrate;
- and
- separating the miniature ESCs through a dicing process.
6 more elements
Dependencies are inferred from the claim text.