H10N 69/00
Integrated devices, or assemblies of multiple devices, comprising at least one superconducting
Official title: Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
H10N69/00 (Integrated devices, or assemblies of multiple devices, comprising at least one superconducting) appears on 842 US grants and 972 published applications in this corpus.
Search patents in H10N- Granted patents
- 842
- Published applications
- 972
- Assignees
- 221
- Inventors
- 1,391
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 8 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 2 |
| 2003 | 5 | 13 |
| 2004 | 6 | 13 |
| 2005 | 5 | 10 |
| 2006 | 10 | 2 |
| 2007 | 3 | 3 |
| 2008 | 3 | 2 |
| 2009 | 2 | 4 |
| 2010 | 2 | 2 |
| 2011 | 2 | 7 |
| 2012 | 7 | 3 |
| 2013 | 6 | 5 |
| 2014 | 6 | 8 |
| 2015 | 11 | 22 |
| 2016 | 17 | 14 |
| 2017 | 19 | 22 |
| 2018 | 17 | 43 |
| 2019 | 77 | 105 |
| 2020 | 102 | 96 |
| 2021 | 76 | 109 |
| 2022 | 67 | 111 |
| 2023 | 103 | 111 |
| 2024 | 100 | 103 |
| 2025 | 83 | 91 |
| 2026 | 57 | 69 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Quantum bit chip having a stack of qubit wafers and spacer wafers, and a method for fabricating the quantum bit chip22 Sep 2026US 12,745,573 B2Imec Vzw
- Microwave photonic quantum processor15 Sep 2026US 12,737,658 B2Miraex SA
- Circuit apparatus and control method15 Sep 2026US 12,738,948 B2NEC Corporation
- Superconducting vacuum-bridged Josephson junctions15 Sep 2026US 12,740,329 B2IQM Finland Oy
- Quantum computing circuit comprising a plurality of chips and method for manufacturing the same8 Sep 2026US 12,731,057 B2IQM Finland Oy
- Systems and methods for fabricating superconducting integrated circuits24 Sep 2026US 2026/0293535 A1D-Wave Systems Inc.
- Substrate structure and method for fabricating a substrate structure17 Sep 2026US 2026/0282764 A1
- Temperature sensing of regions within a superconducting integrated circuit using in-situ resonators27 Aug 2026US 2026/0255885 A1Microsoft Technology Licensing, LLC
- Qubit Detection Using Superconductor Devices20 Aug 2026US 2026/0244961 A1Psiquantum, Corp.
- High density connector for superconducting applications20 Aug 2026US 2026/0246213 A1IQM Finland Oy
Most cited
By later US patents
- Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate135US 5,159,413 AEaton Corporation · 1992
- Superconducting quantum-bit device based on Josephson junctions134US 6,838,694 B2Commissariat A L' Energie Atomique · 2005
- Method of making a monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate106US 5,356,831 AEaton Corporation · 1994
- Quantum processor97US 7,932,515 B2D-Wave Systems Inc. · 2011
- Encoding and error suppression for superconducting quantum computers92US 7,307,275 B2D-Wave Systems Inc. · 2007