Substrate structure and method for fabricating a substrate structure

A method for fabricating a substrate structure, comprising:

• providing a stack structure comprising a first substrate, a plastically deformable superconductor layer, and a second substrate, wherein the first substrate comprises a main surface with a topographic structure and the second substrate comprises a main surface facing the main surface of the first substrate, wherein the main surface of the first substrate comprises a structured superconductor metallization and the main surface of the second substrate comprises a structured superconductor metallization, wherein the plastically deformable superconductor layer extends between the structured superconductor metallization of the first substrate and the structured superconductor metallization of the second substrate, and
• exerting pressure to the first and second substrate for compressing the plastically deformable superconductor layer between the structured superconductor metallizations of the first and second substrates in order to form a mechanical and electrical superconductor connection between the structured superconductor metallizations of the first and second substrates.