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US 7,932,515 B2Granted
Quantum processor
AssigneeD-Wave Systems Inc.
InventorPaul I. Bunyk
Life of this patent
Estimating the term…
Abstract
Multiple substrates that carry quantum devices are coupled to provide quantum mechanical communicators therebetween, for example, using superconducting interconnects, vias, solder and/or magnetic flux. Such may advantageously reduce a footprint of a device such as a quantum processor.
Claims20
A multi-chip processor comprising:
- a first plurality of quantum devices carried by a first substrate, wherein the first plurality of quantum devices includes a first set of qubits and a first set of couplers;
- a second plurality of quantum devices carried by a second substrate, wherein the second plurality of quantum devices includes a second set of qubits and a second set of couplers;
- and
- at least one multi-substrate coupler communicatively coupleable to a first quantum device of the first plurality of quantum devices and a second quantum device of the second plurality of quantum devices to couple quantum information therebetween.
1 more element
A method of coupling quantum information between at least a first qubit carried by a first substrate and at least a second qubit carried by a second substrate, the method comprising:
- coupling quantum information from the first qubit carried by the first substrate to the second qubit carried by the second substrate via a first multi-substrate coupler;
- and
- coupling quantum information from the second qubit carried by the second substrate to the first qubit carried by the first substrate via the first multi-substrate coupler.
Dependencies are inferred from the claim text.