Quantum computing circuit comprising a plurality of chips and method for manufacturing the same

A quantum computing circuit comprising:

• a first chip including at least one qubit;
• a second chip including (i) a quantum circuit refrigerator comprising a superconductor-insulator-normal metal-insulator-superconductor (SINIS) junction and (ii) at least other quantum circuit elements other than qubits;
• and
• a controllable connection between the quantum circuit refrigerator and at least one qubit on the first chip, wherein the controllable connection enables the quantum circuit refrigerator to be controllably used to reset a state of the at least one qubit;
• wherein the first chip and the second chip are stacked together in a flip-chip configuration and attached to each other via bump bonding that includes bonding bumps.