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US 12,740,329 B2Granted
Superconducting vacuum-bridged Josephson junctions
AssigneeIQM Finland Oy
InventorsWei Qiu, Wei Liu, Tianyi Li
Life of this patent
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Abstract
The invention relates to the field of superconducting integrated circuits. The invention includes an integrated circuit device comprising a substrate, a Josephson junction on the substrate, external electrodes on the substrate and spaced apart from the Josephson junction, and bridge connections connecting the Josephson junction to the external electrodes. The invention also includes a method for manufacturing such an integrated circuit device.
Claims12
A method of manufacturing an integrated circuit device, the method comprising:
- forming a Josephson junction and external electrodes on a substrate such that the Josephson junction is spaced apart from the external electrodes;
- depositing a resist over the substrate, the Josephson junction and the external electrodes;
- patterning the resist such that contact pads on the Josephson junction and the external electrodes are exposed, and such that the patterned resist between the contact pads defines bridge connection support portions;
- depositing a superconducting thin film over the resist such that the superconducting thin film is in direct electrical contact with the contact pads;
- and
- forming bridge connections by removing the resist and the superconducting thin film except for the superconducting thin film deposited on the contact pads and over the bridge connection support portions.
3 more elements
An integrated circuit device produced by:
- forming a Josephson junction and external electrodes on a substrate such that the Josephson junction is spaced apart from the external electrodes;
- depositing a resist over the substrate, the Josephson junction and the external electrodes;
- patterning the resist such that contact pads on the Josephson junction and the external electrodes are exposed, and such that the patterned resist between the contact pads defines bridge connection support portions;
- depositing a superconducting thin film over the resist such that the superconducting thin film is in direct electrical contact with the contact pads;
- and
- forming bridge connections by removing the resist and the superconducting thin film except for the superconducting thin film deposited on the contact pads and over the bridge connection support portions.
3 more elements
Dependencies are inferred from the claim text.