H10H 20/018
Bonding of wafers
Official title: {Bonding of wafers}
H10H20/018 (Bonding of wafers) appears on 3,816 US grants and 4,933 published applications in this corpus.
Search patents in H10H- Granted patents
- 3,816
- Published applications
- 4,933
- Assignees
- 743
- Inventors
- 4,984
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 16 | 10 |
| 2002 | 22 | 35 |
| 2003 | 24 | 42 |
| 2004 | 35 | 71 |
| 2005 | 44 | 109 |
| 2006 | 46 | 110 |
| 2007 | 48 | 141 |
| 2008 | 60 | 159 |
| 2009 | 60 | 141 |
| 2010 | 129 | 254 |
| 2011 | 171 | 312 |
| 2012 | 216 | 268 |
| 2013 | 250 | 274 |
| 2014 | 310 | 273 |
| 2015 | 270 | 253 |
| 2016 | 228 | 197 |
| 2017 | 187 | 202 |
| 2018 | 182 | 224 |
| 2019 | 226 | 238 |
| 2020 | 225 | 266 |
| 2021 | 178 | 261 |
| 2022 | 181 | 305 |
| 2023 | 146 | 276 |
| 2024 | 202 | 239 |
| 2025 | 205 | 179 |
| 2026 | 120 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Edge-emitting semiconductor devices and related methods29 Sep 2026US 12,751,329 B2CreeLED, Inc.
- Method for transferring an optoelectronic device15 Sep 2026US 12,740,489 B2Aledia
- Manufacturing method of display device using deformable spacers8 Sep 2026US 12,733,295 B2Japan Display Inc.
- Semiconductor light emitting diode including passivation layer having different thicknesses1 Sep 2026US 12,727,293 B2Samsung Display Co., Ltd.
- Substrate encapsulating method, display panel, and display device1 Sep 2026US 12,727,507 B2Huizhou China Star Optoelectronics Display Co., Ltd.
- Display device and manufacturing method thereof8 Oct 2026US 2026/0314141 A1Samsung Display Co., Ltd.
- Light-emitting diode structure and method of manufacturing the same1 Oct 2026US 2026/0305472 A1United Microelectronics Corp.
- Vertical tethers for micro-transfer printing24 Sep 2026US 2026/0293371 A1X-Celeprint Limited
- Method of manufacturing chip-on-wafer for micro led display17 Sep 2026US 2026/0282602 A1Wavelord Co., Ltd
- Method for manufacturing inorganic light emitter27 Aug 2026US 2026/0255728 A1Magnolia White Corporation
Most cited
By later US patents
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Separation of thin films from transparent substrates by selective optical processing783US 6,071,795 AThe Regents of the University of California · 2000
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011