Manufacturing method of display device using deformable spacers
AssigneeJapan Display Inc.
InventorsKazuyuki Yamada, Keisuke Asada, Kenichi Takemasa, Daiki Isono
Life of this patent
Estimating the term…
Abstract
Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.
Claims18
A manufacturing method of a display device comprising:
- transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate;
- arranging a plurality of spacers configured to be elastically deformable over a substrate over which a pixel including a plurality of sub-pixels is arranged;
- and
- transferring the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate,
- wherein the transfer of the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate is performed by
- pressing the first carrier substrate and the substrate against each other so that the pixel and the at least one inorganic light-emitting diode are sandwiched by the first carrier substrate and the substrate, at least one of the plurality of spacers is deformed, and the at least one inorganic light-emitting diode is electrically connected to one of the plurality of sub-pixels, and
- removing the first carrier substrate to leave the at least one inorganic light-emitting diode spaced from the plurality of spacers over the substrate.
A manufacturing method of a display device, the manufacturing method comprising:
- transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate;
- transferring the at least one inorganic light-emitting diode over the first carrier substrate onto a second carrier substrate;
- arranging a plurality of spacers configured to be elastically deformable over a substrate over which a pixel including a plurality of sub-pixels is arranged;
- and
- transferring the at least one inorganic light-emitting diode over the second carrier substrate onto the substrate,
- wherein the transfer of the at least one inorganic light-emitting diode over the second carrier substrate onto the substrate is performed by
- pressing the second carrier substrate and the substrate against each other so that the pixel and the at least one inorganic light-emitting diode are sandwiched by the second carrier substrate and the substrate, at least one of the plurality of spacers is deformed, and the at least one inorganic light-emitting diode is electrically connected to one of the plurality of sub-pixels, and
- removing the second carrier substrate to leave the at least one inorganic light-emitting diode spaced from the plurality of spacers over the substrate.
Dependencies are inferred from the claim text.