Method for transferring an optoelectronic device
AssigneeAledia
InventorsFrédéric Mayer, Clémence Tallet, Nohora Caicedo
Life of this patent
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Abstract
A method for transferring a device from a first substrate to a second substrate by way of a manipulation substrate. The method includes bonding the device to the manipulation substrate by way of an assembly layer at a bonding surface, partially etching the assembly layer so as to conserve a narrow portion interposed between the device and the manipulation substrate, the narrow portion having a cross section strictly smaller than the bonding surface, the method being characterized in that the assembly layer is formed beforehand on the manipulation substrate and exclusively on the manipulation substrate.
Claims19
A method for transferring an optoelectronic device from a first substrate to a second substrate via a handling substrate, said method comprising at least the following steps:
- provide the first substrate carrying the optoelectronic device,
- provide the handling substrate,
- bond the optoelectronic device over the handling substrate via a bonding layer at a first face of the device, said first face having a bonding surface extending according to a base plane,
- remove the first substrate,
- partially etch the bonding layer so as to preserve a narrow portion of the bonding layer interposed between the first face of the device and the handling substrate, said narrow portion having a cross-section, considered in a plane parallel to the base plane, strictly smaller than the bonding surface,
- detach the optoelectronic device of the handling substrate, the method being characterised in that the bonding layer is formed prior to bonding over the handling substrate and only over the handling substrate.
Dependencies are inferred from the claim text.