H10F 39/811
Interconnections
Official title: {Interconnections}
H10F39/811 (Interconnections) appears on 6,032 US grants and 8,017 published applications in this corpus.
Search patents in H10F- Granted patents
- 6,032
- Published applications
- 8,017
- Assignees
- 759
- Inventors
- 7,130
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 5 |
| 2002 | 23 | 22 |
| 2003 | 11 | 26 |
| 2004 | 25 | 54 |
| 2005 | 37 | 99 |
| 2006 | 45 | 109 |
| 2007 | 56 | 95 |
| 2008 | 62 | 130 |
| 2009 | 72 | 167 |
| 2010 | 122 | 208 |
| 2011 | 133 | 133 |
| 2012 | 124 | 141 |
| 2013 | 130 | 217 |
| 2014 | 197 | 223 |
| 2015 | 249 | 352 |
| 2016 | 383 | 516 |
| 2017 | 426 | 551 |
| 2018 | 488 | 525 |
| 2019 | 474 | 538 |
| 2020 | 502 | 577 |
| 2021 | 419 | 619 |
| 2022 | 397 | 567 |
| 2023 | 383 | 546 |
| 2024 | 463 | 662 |
| 2025 | 461 | 548 |
| 2026 | 309 | 387 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-substrate image sensor device and method with metalens6 Oct 2026US 12,757,503 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Image sensor with optical structure for flare reduction6 Oct 2026US 12,757,510 B2OmniVision Technologies, Inc.
- Structures including a photodetector and multiple deep trenches6 Oct 2026US 12,757,512 B2Globalfoundries Singapore Pte. Ltd.
- Solid-state imaging device and imaging apparatus6 Oct 2026US 12,757,513 B2Sony Semiconductor Solutions Corporation
- Sensor manufacturing method and sensor8 Oct 2026US 2026/0314086 A1The Hong Kong University of Science and Technology
- Image sensor device and method8 Oct 2026US 2026/0314088 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor with shared gate architecture for metal layer reduction8 Oct 2026US 2026/0314092 A1OmniVision Technologies, Inc.
- Image sensing device8 Oct 2026US 2026/0314097 A1SK hynix Inc.
- Image sensor device and methods of forming the same8 Oct 2026US 2026/0314103 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- Three-dimensional integrated circuit device and its manufacturing method469US 5,998,808 ASony Corporation · 1999
- Optical systems fabricated by printing-based assembly346US 8,722,458 B2Semprius, Inc. · 2014
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016